5295 Thermal Conductive Silicone Potting Compound 1:1 Mix UL94V-0

5295 TDS-EN.pdf

Huitian 5295 is a cutting-edge two-part addition-type potting compound tailored for demanding electrical and electronic applications. Boasting a 1:1 mixing ratio for hassle-free handling, thermal conductivity to effectively manage heat, and UL94V-0 flame retardancy, it offers a robust solution to protect components from environmental hazards while ensuring efficient thermal management. Perfect for power-hungry devices, it strikes a balance between production efficiency and long-term performance, simplifying the manufacturing process and boosting product durability.

Product Applications

• PV Inverters: Seals power modules, enhancing thermal efficiency and shielding against dust and moisture.
• LED Drivers: Encapsulates circuitry to control heat accumulation, thus prolonging the lifespan of LEDs.
• Charging Piles (EV Chargers): Protects internal components from vibration, moisture, and high temperatures during rapid charging.
• Automotive Electronics: Secures ECUs, sensors, and actuators, withstanding temperature variations and mechanical stress.
• NEV Power & Controllers: Ensures thermal stability and flame resistance in new energy vehicle power systems, reducing fire risks.

Product Features

1. Efficient Thermal Management
   Equipped with optimized thermal conductivity, it effectively prevents overheating and component failure in heat-intensive devices.
2. UL94V - 0 Flame Retardancy
   It meets strict fire-safety standards, significantly reducing fire hazards in electrical systems.
3. 1:1 Mixing Simplicity
   The equal-part mixing (by weight or volume) reduces measurement errors, speeding up production and ensuring consistent curing.
4. Addition - Cure Technology
   This technology enables curing without by-products (such as alcohol or water), leading to low shrinkage and excellent dimensional stability, making it ideal for precision potting.
5. Superior Electrical & Mechanical Properties
   With high electrical strength and insulation resistance, it protects against short circuits. The flexible cured matrix absorbs vibration and shock, improving long-term reliability.
6. Wide Temperature Adaptability
   It performs reliably in extreme temperature conditions, matching the operating ranges of automotive and industrial electronics.

Product Specifications

Packaging & Storage

• Packaging: Available as separate containers of Part A and Part B (25kg + 25kg drums).
• Storage: Store in a cool, dry place (0–35℃). Avoid direct sunlight and moisture.
• Shelf Life: 12 months from the manufacturing date when stored unopened.
• Handling: Seal containers after use to prevent moisture contamination, as addition - cure systems are sensitive to moisture.

Silicone Potting Compound

potting compound for electronic components

5295 Thermal Conductive Silicone Potting Compound 1:1 Mix UL94V-0 Images